Single substrate RIE system with advanced software for etching oxide, nitride, polyimide and other films. Has electrode cooling, up to 3,000 watts, 200mm size, variable electrode spacing, digital mass flow control, throttle valve control, DC bias and end point options. Optional turbo pump, Inductively Coupled Plasma Source and various end point options available.
We invite our Customers to visit our lab to run samples.
AutoGlow 200—updated chamber design with removable electrode shelves to configure for bottom power processing (RIE) or top power (plasma) processing of 8” substrates. Shelves can be placed according to need. The system now has LED diagnostic display, nitrogen chamber soft purge and a display for DC bias. Up to 600 watts of power.