The ST1200 plasma system is a single substrate RIE system with advanced software. This results in the ability of etching oxide, nitride, polyimide and other films. With standard features like electrode cooling, up to 3,000 watts, 200mm size, variable electrode spacing, digital mass flow control, throttle valve control, DC bias and end point options. Also an optional turbo pump, Inductively Coupled Plasma Source and various end point options are available.
We invite our Customers to visit our lab to run samples.
With an updated chamber design including removable electrode shelves resulting in a configure for bottom power processing (RIE) or top power (plasma) processing of 8” substrates. Shelves can be placed according to need. The system now has LED diagnostic display, nitrogen chamber soft purge and a display for DC bias. Up to 600 watts of power.