Plasma cleaning hybrid circuits with Argon is a safe and effective way to remove epoxy bleed out, baked photoresist, solder flux, or other organic contaminants.
Plasma cleaning hybrid circuits improves wire bond strength and will increase yield and throughput. Documented test have shown up to a 70% decrease in wire bond failures after plasma cleaning. A five to ten minute cycle is generally sufficient.
Several systems are offered starting as low as $7,300. for large scale manufacturing the AutoGlow 1000 is recommended. Most people use Argon gas with a process lasting 5-10 minutes. Pictured below is the AutoGlow 200 with shelves that can be powered (RIE conditions) or grounded (Plasma conditions).
To see details and a video of the AutoGlow 200/300 click HERE
To see details and a video of the AutoGlow 1000 click HERE
To see details and a video on the GLOW click HERE
To contact Glow Research International click HERE
To see details of the below abstract click HERE