Oxygen and CF4 plasma are used in failure analysis to remove passivization layers including silicon nitride, silicon dioxide, polyimide and oxynitride.
The OptiGlow ACE can be used for removing plastic encapsulation for failure analysis applications. Plasma is a safe, non-destructive process which does not damage interconnection patterns, lead bonds or the device itself.
We have had recent success–with high removal rates—removing expoxy underfill with a CF4 process in our OptiGlow ACE system using RIE conditions.