Plasma Removal of Encapsulant to reveal Copper Pillars
Removing Non-Conductive NCP
Paste Encapsulant to reveal Copper Pillars with the OptiGlow ACE plasma system
Paste Encapsulant to reveal Copper Pillars with the OptiGlow ACE plasma system
The following data and graph shows before plasma removal and after:
In Summary:
-Plasma Removal of NCP Encapsulant to reveal Copper Pillars using the powered electrode shelf in the OptiGlow ACE system
- -The epoxy encapsulant material was most definitely removed by the OptiGlow ACE plasma etching system
- -Approximately 20 microns were etched away
- -No other obvious adverse effects to the part were identified
- -The process gas was a mixture of CF4 and O2
- -The power and pressure were adjusted for maximum removal rate of 1um/min
- -Recipes have also been developed for the removal of underfill surrounding SnAg solder bumps
OptiGlow ACE system
- For more information please contact Glow Research
USA 480-621-845
